Product SKUs
- MBD-X12SPO-NTF
Physical Stats
- Form Factor
ATX
- Dimension
12″ x 10″ (30.48cm x 25.4cm)
Processor
- CPU
3rd Gen Intel Xeon Scalable processors
Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP - Core
Up to 40 cores
System Memory
- Memory Capacity
8 DIMM slots
Up to 2TB Intel Optane Persistent Memory 200 Series
Up to 2TB 3DS ECC LRDIMM, DDR4-3200MT/s; Up to 2TB 3DS ECC RDIMM, DDR4-3200MT/s - Memory Type
3200/2933/2666 MT/s ECC , DDR4 LRDIMM (3DS), RDIMM (3DS)
- DIMM Sizes
8GB, 16GB, 32GB, 64GB, 128GB, 256GB
- Memory Voltage
1.2V
- Error Detection
Corrects single-bit errors
On-Board Devices
- Chipset
Intel C621A
- SATA
Intel C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10
- IPMI
ASPEED AST2600 BMC
- Graphics
1 ASPEED AST2600 BMC port(s)
- Network Controllers
Dual LAN with Intel X550 10GBase-T Ethernet Controller
Input / Output
- SATA
10 SATA3 (6Gbps) port(s)
- LAN
2 RJ45 10 Gigabit Ethernet LAN ports
- USB
6 USB 2.0 port(s) (4 via header; 2 rear)
5 USB 3.2 Gen1 port(s) (2 via header; 2 rear; 1 type A) - Video Output
1 VGA port(s)
- Serial Port
2 COM Port(s) (1 header; 1 rear)
- DOM
2 SATA DOM (Disk on Module) power connector support
- TPM
1 TPM Header
Expansion Slots
- PCIe
1 PCIe 4.0 x16
- M.2
M.2 Interface: 2 SATA/PCIe 3.0 x4
Form Factor: 2280/22110
Key: M-Key
System BIOS
- BIOS Type
AMI UEFI
- BIOS Features
ACPI 6.2
SMBIOS 3.0 or later
UEFI 2.7
Management
- Power Configurations
Power-on mode for AC power recovery, ACPI Power Management, CPU thermal trip support for processor protection
